Company profile
Company introduction
Organizational structure
Milestone
Development planning
Qualifications and qualifications
BOD Series
COB Series
SMD Series
General illumination
Cinematography
Intelligent control
Subdivision specialty
Industrial light source
Other lighting
School of packaging
Technology development
R&d results
Patent layout
Growth plan
Talent demand
Welfare treatment
Industry dynamics
Company news
Q&A
Challenges and opportunities coexist: a comprehensive analysis of COB packaging technologyCOB packag
What is COB?Its full name is chip-on-board, that is, chip on board packaging, which is a new packagi
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Address:Building B, Emmett Science Park, Luorent Community, Shiyan Street, Baoan District, Shenzhen
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